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HANBit
HMF1M32M8S
FLASH-ROM MODULE 4MByte (1M x 32-Bit), 72pin-SIMM, 5V Part No. HMF1M32M8S (Switching for write enable/disable)
GENERAL DESCRIPTION
The HMF1M32M8S is a high-speed flash read only memory (FROM) module containing 1,048,576 words organized in a x32bit configuration. The module consists of eight 512K x 8 FROM mounted on a 72 -pin, both-sided, FR4-printed circuit board.In order to write control, the HMF1M32M8S provides Write Enable and Write Disable selection by SMT switch. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0V flash or EPROM devices. Eight chip enable inputs, (/CE-UU1, /CE_UM1, /CE_LM1, /CE_LL1, /CE_UU2, /CE_UM2, /CE_LM2, /CE_LL2) are used to enable the module's 4 bytes independently. Output enable (/OE) and write enable (/WE) can set the memory input and output .. When FROM module is disable condition the module is becoming power standby mode, system designer can get low -power design. All module components may be powered from a single +5V DC power supply and all inputs and outputs are TTL compatible
FEATURES
w Access time: 70, 90 and 120ns wSwitching for write enable and disable. w High-density 4MByte design w High-reliability, low-power design w Single + 5V 0.5V power supply w Easy memory expansion w All inputs and outputs are TTL-compatible w FR4-PCB design w Low profile 72-pin SIMM w Minimum 100,000 write/erase cycle w Sector erases architecture w Sector group protection w Temporary sector group unprotection PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 -70 -90 -120 18 SYMBOL VSS A3 A2 A1 A0 VCC A11 /OE A10 VCC /CE-LL2 /CE-LL1 DQ7 DQ0 DQ1 DQ2 DQ6 DQ5 PIN 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
PIN ASSIGNMENT
SYMBOL DQ4 DQ3 /WE A17 A14 A13 VCC DQ8 DQ9 DQ10 /CE-LM2 VCC /CE-LM1 DQ15 DQ14 DQ13 DQ12 DQ11 PIN 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 SYMBOL A18 A16 VSS A6 VCC A5 A4 VCC /CE-UM2 /CE-UM1 DQ23 DQ16 DQ17 DQ18 DQ22 DQ21 DQ20 DQ19 PIN 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 SYMBOL VCC A15 A12 A7 VCC A8 A9 DQ24 DQ25 DQ26 /CE-UU2 /CE-UU1 DQ31 DQ30 DQ29 DQ28 DQ27 VSS
OPTIONS
w Timing 70ns access 90ns access 120ns access w Packages 72-pin SIMM
MARKING
SIMM TOP VIEW
M
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FUNCTIONAL BLOCK DIAGRAM
HMF1M32M8S
DQ 0-DQ31 A0-A18
DQ 32 A19
A0-18
A0-18 DQ0-7 /WE /OE /CE-LL2
A0-18 DQ0-7 /WE
U1
/CE
/CE-LL1
/OE
U5
/CE
A0-18 DQ8-15 /WE /OE
A0-18 DQ8-15
/WE
U2
/CE
/CE-LM1
/OE /CE
U6
/CE-LM2
A0-18 DQ 16-23 /WE /OE /CE-UM2
A0-18 DQ16-23 /WE
U3
/CE /CE-UM1
/OE
U7
/CE
A0-18 /WE /WE /OE /OE DQ24-31 /WE
A0-18 DQ 24-31 /WE /OE
U4
/CE
/OE
U8
/CE
/CE-UU2
/CE-UU1
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HMF1M32M8S
TRUTH TABLE
MODE STANDBY NOT SELECTED READ WRITE NOTE: X means don't care /OE X H L H /CE H L L L /WE X H H L DQ HIGH-Z HIGH-Z Q D POWER STANDBY ACTIVE ACTIVE ACTIVE
ABSOLUTE MAXIMUM RATINGS
RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VALUE 0 oC to 70 oC -65 oC to 125 oC -0.5V to 7.0V -0. 5V to 7.0V VCC to Ground Potential A9 & /OE -0.2V to 7.0V -0.2V to 12.5V
wNOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. Specifications contained within the following tables are subject to change.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER Vcc for 5% device Supply Voltages Vcc for 10% device Supply Voltages Ground SYMBOL VCC Vcc VSS MIN 4.75V 4.5V 0 0 TYP. MAX 5.25V 5.5V 0
DC AND OPERATING CHARACTERISTICS (0oC TA 70 oC ; Vcc = 5V 0.5V )
PARAMETER Input Leakage Current Output Leakage Current Input High Voltage TEST CONDITIONS Vcc=Vcc max, V IN= GND to Vcc Vcc=Vcc max, VOUT= GND to Vcc SYMBOL IL1 IL0 VIH 0.7x VCC MIN MAX 1.0 10 VCC + 0.3 UNITS A A V
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Input Low Voltage Output High Voltage Output Low Voltage Vcc Active Current for Read Vcc Active Current for Program Vcc Active Current for Erase Vcc Standby Current Notes IOH = -2.5mA, Vcc = Vcc min IOL = 12mA, Vcc =Vcc min /CE=VIL, /OE=VIH /CE=VIL, /OE=VIH /CE=VIL, /OE=VIH /CE= V1H VIL VOH VOL ICC1 ICC2 ICC2 Icc3
HMF1M32M8S
-0.5 2.4 0.45 30 40 40 5 0.8 V V V mA mA mA mA
1.V1L min.=-1.0V for pulse width is equal to or less than 50ns. V1L min. =-2.0V for pulse width is equal to or less than 20 2.V1H max. =VCC+1.5V for pulse width is equal to or less than 20ns. If V 1H is over the specified maximum value, read operation cannot be guaranteed.
SWITCHING TEST CIRCUITS
5.0V
2.7k Device Under Test CL 6.2k Diodes = IN3064 or Equivalent
Note : CL = 100pF including jig capacitance
AC CHARACTERISTICS u Read Only Operations Characteristics
SPEED PARAMETER tRC tACC tCE tOE tDF tOEH DESCRIPTION Read Cycle Time Address Access time Chip Enable to Access time Output Enable time Chip Enable to Output High-Z Output Enable Hold Time - 70 70 70 70 30 20 0 -90 90 90 90 35 20 0 -120 120 120 120 50 30 0 UNIT ns ns ns ns ns ns
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tOH Output Hold Time From Addresses, /CE or /OE 0 0
HMF1M32M8S
0 ns
u Erase/Program Operations
PARAMETER tWC tAS tAH tDS tDH tOES tGHWL tCS tCH tWP tWPH tWHWH1 t WHWH2 tVCS DESCRIPTION Write Cycle Time (Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation Vcc set up time (Note 1) -70 70 0 45 30 0 0 0 0 0 35 20 7 1 50 -90 90 0 45 45 0 0 0 0 0 45 20 7 1 50 -120 120 0 50 50 0 0 0 0 0 50 20 7 1 50 UNIT ns ns ns ns ns ns ns ns ns ns ns s sec s
Notes : : 1. Not 100% tested
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u READ OPERATIONS TIMING
HMF1M32M8S
u RESET TIMING
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u PROGRAM OPERATIONS TIMING
HMF1M32M8S
u CHIP/SECTOR ERASE OPERATION TIMINGS
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u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
HMF1M32M8S
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
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u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
HMF1M32M8S
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
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PACKAGE DIMMENSIONS
HMF1M32M8S
2.54 mm MIN 0.25 mm MAX 1.270.08
1.27
Gold: 1.040.10 mm Solder: 0.9140.10 mm
(Solder & Gold Plating)
ORDERING INFORMATION
Component Number 8EA 8EA 8EA
Part Number
Density
Org.
Package
Vcc
SPEED
HMF1M32M8S-70 HMF1M32M8S-90 HMF1M32M8S-120
4MByte 4MByte 4MByte
1MX 32bit 1MX 32bit 1MX 32bit
72 Pin-SIMM 72 Pin-SIMM 72 Pin-SIMM
5.0V 5.0V 5.0V
70ns 90ns 120ns
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